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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Deleruyelle, Damien
Institut National des Sciences Appliquées de Lyon
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (26/26 displayed)
- 2024Development of ferroelectric and antiferroelectric H1-xZrxO2-based capacitors for non-volatile memories and power supply applications
- 2024Serendipity in materials science: how a simple doping leads to novel and outstanding properties in simple dielectric HfO2 !
- 2024Stabilization of low dimensional ferroelectric HfZrO2 film
- 2023How ALD deposition analysis can help PVD deposition process!
- 2023How ALD deposition analysis can help PVD deposition process!
- 2023Engineering the nano and micro structures of sputtered HfZrO2 thin films
- 2023Engineering the nano and micro structures of sputtered HfZrO2 thin films
- 2023Interplay between Strain and Defects at the Interfaces of Ultra‐Thin Hf 0.5 Zr 0.5 O 2 ‐Based Ferroelectric Capacitorscitations
- 2023Interplay between Strain and Defects at the Interfaces of Ultra‐Thin Hf 0.5 Zr 0.5 O 2 ‐Based Ferroelectric Capacitorscitations
- 2023Interface engineering between HfZrO2 thin films and electrodes for enhanced ferroelectricity
- 2023Interface engineering between HfZrO2 thin films and electrodes for enhanced ferroelectricity
- 2022Fabrication process for sub-8 nm HfZrO2-based ferroelectric tunnel junctions with enhanced properties
- 2022Ferroelectricity Improvement in Ultra-Thin Hf0.5Zr0.5O2 Capacitors by the Insertion of a Ti Interfacial Layercitations
- 2022Ferroelectricity Improvement in Ultra-Thin Hf0.5Zr0.5O2 Capacitors by the Insertion of a Ti Interfacial Layercitations
- 2022A multiscale study of the structure, chemistry and ferroelectric properties of epitaxial sol-gel PbZr0.2Ti0.8O3 films for nanomechanical switching
- 2022A multiscale study of the structure, chemistry and ferroelectric properties of epitaxial sol-gel PbZr0.2Ti0.8O3 films for nanomechanical switching
- 2022How to play on the fabrication process of HfZrO2 ferroelectric thin film to enhance its physical properties
- 2021Electrical Characterisation of HfZrO2 Ferroelectric Tunnel Junctions for Neuromorphic Application
- 2021Bottom electrodes impact on Hf0.5Zr0.5O2 ferroelectric tunnel junctions
- 2021Bottom electrodes impact on Hf0.5Zr0.5O2 ferroelectric tunnel junctions
- 2021Effect of bottom electrodes on HZO thin film properties
- 2021Impact of a dielectric layer at TiN/HfZrO2 interface for ferroelectric tunnel junctions applications
- 2021Impact of a dielectric layer at TiN/HfZrO2 interface for ferroelectric tunnel junctions applications
- 2021Role of ultra-thin Ti and Al interfacial layers in HfZrO2 ferroelectric tunnel junctions
- 2021Role of ultra-thin Ti and Al interfacial layers in HfZrO2 ferroelectric tunnel junctions
- 2014Photo-Cross-Linked Diblock Copolymer Micelles: Quantitative Study of Photochemical Efficiency, Micelles Morphologies and their Thermal Behaviorcitations
Places of action
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document
Electrical Characterisation of HfZrO2 Ferroelectric Tunnel Junctions for Neuromorphic Application
Abstract
Ferroelectric Tunnel Junctions (FTJ), which can modulate their electro-resistance depending on the polarisation configuration, have demonstrated multi-state, synaptic behaviour [1]. Hf0.5Zr0.5O2 (HZO) based FTJs are an ideal solution for the industrial implementation of brain inspired computing thanks to the low annealing temperature of HZO and its full compatibility with industrial processes. In this work, we present the development of HZO-based FTJs on silicon substrates and their electrical characterisation. A TiN/HZO/Al2O3/TiN structure was fabricated by reactive magnetron sputtering with 11 nm of HZO crystallised using rapid thermal annealing [2,3]. The dielectric layer of Al2O3 was formed from the deposition of Al and the scavanging of oxygen from the HZO layer, leading to increased conductance and enhancing the asymmetry of the junction to reach higher electro-resistance values. The structural properties were investigated by X-ray reflectometry and grazing incidence X-ray diffraction. Positive-Up-Negative-Down measurements with engineered pulse parameters along with quasi-static current-voltage measurements were conducted to evaluate and control the ferroelectric switching of the devices together with their electro-resistance. Cycling measurements were carried out to investigate the evolution of the polarisation and of the resistance ratio until breakdown. Dominant conduction mechanisms across the junction were evaluated by means of in temperature current-voltage measurements and modelling.References: [1] Boyn, S., Grollier, J., Lecerf, G. et al., Nat Commun 8, 14736 (2017). [2] Bouaziz, J. et al., APL Materials 7, 081109 (2019). [3] Bouaziz, PR Romeo, N Baboux, B VilquinACS Applied Electronic Materials 1, 1740-1745 (2019)