| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Dalverny, Olivier
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (22/22 displayed)
- 2023Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditionscitations
- 2022In Situ Ageing with the Platform Preheating of AlSi10Mg Alloy Manufactured by Laser Powder-Bed Fusion Processcitations
- 2019Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurementscitations
- 2019Analysis of the multilayer woven fabric behaviour during the forming process: focus on the loss of cohesion within the woven fibre network
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Sensitivity analysis of composite forming process parameters using numerical hybrid discrete approach
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2017An algorithm for damage detection and localization Usibg output-only response for civil engineering structures subjected to seismic excitations
- 2017An algorithm for damage detection and localization using output-only response for civil-engineering structures subjected to seismic excitation
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network.
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network
- 2016Experimental study of 48600 Carbons fabrics behavior using marks tracking technique method
- 2015Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applicationscitations
- 2015Experimental and Numerical Study of Interfacial Fracture Parameters of a Brazed Joints
- 2012Identification of orthotropic material properties using displacement field measurements
- 2012Non destructive investigation of defects in composite structures by three infrared thermographic techniques
- 2012Micromechanical modeling of brittle damage in composite materials: primary anisotropy, induced anisotropy and opening-closure effects
- 2008Modélisation des assemblages de ballons pressurisés stratosphériques
- 20042D and 3D numerical models of metal cutting with damage effectscitations
- 2002Transient Numerical Models of Metal Cutting using the Johnson-Cook's Rupture Criterion.citations
Places of action
| Organizations | Location | People |
|---|
article
Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurements
Abstract
Temperature-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under harsh loadings. Due to the RoHS directive which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free thermomechanical behavior when subjected to temperature variations. Characterizing solder joints properties remains a challenge as viscoplastic behavior during thermal cycling is complex, and their small dimensions prevent direct measures from being performed. This paper reports the experimentation based on strain gage measurements, allowing the construction of the shear stress-strain hysteresis loop corresponding to Sn3.0Ag0.5Cu (SAC305) solder joints behavior during thermomechanical loading. This methodology, initially developed in 1984 by P. Hall for Sn60Pb40 interconnects, allows the measurement of the strain energy density dissipated during temperature cycles. The approach developed in this study has two objectives: 1) conduct thermal cycles until failure in order to get the number of cycles to failure (N1%), 2) instrument a specific assembly with strain gages to plot the corresponding shear stress-strain hysteresis loop and allow experimental characterization of SAC305 solder joints. Custom daisy-chained 76 I/O Ceramic Ball Grid Array (CBGA76) components were designed and assembled on flame retardant (FR-4) multi-layered (8 copper ground planes) Printed Circuit Boards (PCB). The component and the PCB were optically characterized to measure their corresponding Coefficient of Thermal Expansion (CTE). Four strain gages were specifically placed at the center of the assembly on top and bottom faces of both PCB and CBGA76 component. As-reflowed solder joints were also investigated to ensure that the resulting microstructure and β-Sn grain morphology are representative of those usually observed in SAC305 solder joints after reflow. A slow rate thermal cycle profile was then considered to allow viscoplastic phenomena to occur and the corresponding SAC305 solder joints shear stress-strain hysteresis loop was plotted. Failure analysis revealed that Ag3Sn coarsening and recrystallization occurred which ensure the representativeness of the microstructural changes usually observed on failed SAC305 interconnections during thermomechanical damage. The correlation between the measured strain energy density and measured lifetime corresponds to one point of the energy based fatigue curve for SAC305 solder joints.