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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Liu, Yinong
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (35/35 displayed)
- 2022Pullout behaviour of shape memory alloy fibres in self-compacting concrete and its relation to fibre surface microtopography in comparison to steel fibrescitations
- 2019Nonuniform transformation behaviour of NiTi in a discrete geometrical gradient designcitations
- 2019Modelling and experimental investigation of geometrically graded shape memory alloys with parallel design configurationcitations
- 2018Effect of thermal annealing on stress relaxation and crystallisation of ion beam sputtered amorphous Si1-xGex thin filmscitations
- 2017Functionally graded shape memory alloyscitations
- 2017Experiments on deformation behaviour of functionally graded NiTi structurescitations
- 2016Investigation of Thermal Expansion Effects on Si-Based MEMS Structurescitations
- 2014Pseudoelastic behaviour of perforated NiTi shape memory plates under tensioncitations
- 2013Finite element computational modelling and experimental investigation of perforated NiTi plates under tensioncitations
- 2013Hystoelastic deformation behaviour of geometrically graded NiTi shape memory alloyscitations
- 2012Mechanical behaviour of architectured NiTi materials in complex loading
- 2011Assessment of tension-compression asymmetry of NiTi using circular bulge testing of thin platescitations
- 2011Modélisation numérique EF du comportement mécanique superélastique de plaques fines planes trouées en NiTi
- 2011Thermally induced damages of PECVD SiNx thin filmscitations
- 2011Etude expérimentale du comportement d'une tôle perforée aléatoirement en NiTi superélastique
- 2009Roundrobin SMA modelingcitations
- 2009Elastohysteresis : un modèle 3D phénoménologique précis pour le comportement superélastique d’Alliage à Mémoire de Forme sous chargements complexes
- 2008Gradient anneal of functionally graded NiTicitations
- 2008Effect of annealing on deformation-induced martensite stabilisation of NiTicitations
- 2008Effect of pseudoelastic cycling on the Clausius-Clapeyron relation for stress-induced martensitic transformation in NiTicitations
- 2007Poisson's Ratio of Low-Temperature PECVD Silicon Nitride Thin Filmscitations
- 2007Design of functionally graded NiTi by heat treatmentcitations
- 2007Process condition dependence of mechanical and physical properties of silicon nitride thin filmscitations
- 2006Hysteretic Behaviour of Ferroelasticity of NiTi in Shearcitations
- 2006Thermal Stability of PECVD SiN/sub x/ Filmscitations
- 2006Influence of Thermomechanical Processing on the Superelastic Properties of a Ni-Rich Nitinol Shape Memory Alloycitations
- 2006Effect of oxidation on the chemical bonding structure of PECVD SiN thin filmscitations
- 2005Characterization of Mechanical Properties of Silicon Nitride Thin Films for MEMS Devices by Nanoindentation
- 2005Effects of deposition temperature on the mechanical and physical properties of silicon nitride thin filmscitations
- 2005On the origin of Luders-like deformation of NiTi shape memory alloyscitations
- 2005Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filterscitations
- 2005Thermal processing of polycrystalline NiTi shape memory alloyscitations
- 2004Mechanistic simulation of thermomechanical behaviour of thermoelastic martensitic transformations in polycrystalline shape memory alloyscitations
- 2004Hysteretic behaviour of a Cu-Zn-Al single crystal during superelastic shear deformationcitations
- 2004Evaluation Of Elastic Modulus And Stress Gradient Of PECVD Silicon Nitride Thin Films
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article
Investigation of Thermal Expansion Effects on Si-Based MEMS Structures
Abstract
© 1992-2012 IEEE.This paper presents a study of the effects of stress and thermal expansion of inductively coupled plasma enhanced chemical vapor deposited (ICPCVD) amorphous Si thin films on low-temperature microelectromechanical systems test structures. Experimental data were used in conjunction with finite-element modeling (FEM) to predict deformation in simple microstructures across a wide temperature range from 85 to 300 K. Temperature dependence of residual stress and the coefficient of thermal expansion (CTE) of ICPCVD Si thin films was investigated by characterizing the curvature of bilayer thin-film samples through the use of optical profilometry at low temperature. Extracted parameters were used in an FEM package to confirm the experimental results by correlating with observed deformation of fabricated test structures. It is demonstrated that the experimentally determined CTE enables accurate modeling of the mechanical behavior of thin-film microstructures across a wide range of temperatures. [2015-0175]