| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Słoma, Marcin
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (21/21 displayed)
- 2022Electromagnetic field controlled domain wall displacement for induced strain tailoring in BaTiO3-epoxy nanocompositecitations
- 2021Additive manufacturing of electronics from silver nanopowders sintered on 3D printed low-temperature substratescitations
- 2021Carbon nanotube-based composite filaments for 3d printing of structural and conductive elementscitations
- 2020Conductive ABS/Ni Composite Filaments for Fused Deposition Modeling of Structural Electronicscitations
- 2020Flexible Gas Sensor Printed on a Polymer Substrate for Sub-ppm Acetone Detectioncitations
- 2019Mechanical and thermal properties of ABS/iron composite for fused deposition modelingcitations
- 2019Photonic curing of silver paths on 3D printed polymer substratecitations
- 2019Heterophase materials for fused filament fabrication of structural electronicscitations
- 2018Electrically conductive acrylonitrile butadiene styrene(ABS)/copper composite filament for fused deposition modelingcitations
- 2018Characterization of PMMA/BaTiO3 Composite Layers Through Printed Capacitor Structures for Microwave Frequency Applicationscitations
- 2016Microwave properties of sphere-, flake-, and disc-shaped BaFe<inf>12</inf>O<inf>19</inf> nanoparticle inks for high-frequency applications on printed electronicscitations
- 2016Rheology of inks for various techniques of printed electronicscitations
- 2015Perovskite-type KTaO 3–reduced graphene oxide hybrid with improved visible light photocatalytic activitycitations
- 2015Influence of electric field on separation and orientation of carbon nanotubes in spray coated layerscitations
- 2015Simple optical method for recognizing physical parameters of graphene nanoplatelets materials
- 2014Thick Film Polymer Composites with Graphene Nanoplatelets for Use in Printed Electronics citations
- 2014Optical measurements of selected properties of nanocomposite layers with graphene and carbon nanotubes fillerscitations
- 2013Miniaturized coupled-line directional coupler designed with the use of photoimageable Thick-Film technology
- 2012Screen printed polymer pastes with carbon nanotubes for printed electronics applications
- 2012SAC 305 solder paste with carbon nanotubes - Part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste propertiescitations
- 2010Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder jointscitations
Places of action
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booksection
Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints
Abstract
<p>Several nanomaterials like silver nanoparticles and carbon nanotubes were obtained and their size and microstructure were investigated. The silver nanoparticles were characterized by different grain size (from below 10 nm up to 200 nm) and microstructure. The diameter of the carbon nanotubes was 5 ÷ 50 nm and the length 0.5 ÷10 μm (max 100 μm). These nanomaterials were mixed with our own prepared SAC solder paste. Several technological properties of the "nano" solder pastes were investigated like spreading, wetting, solder ball and slump. The "nano" solder pastes were used for soldering on Cu substrates. Some mechanical properties of the "nano" solder joints were also investigated. Microstructure of the "nano" solder joints were carried out using SEM equipped with energy dispersive X-ray spectroscopy (EDS) system. Relation between properties of the solder joints with nano particles and their microstructure was analyzed.</p>