Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2024Cs3LiGe4, One Compound with Two Complementary Structural Descriptions: Isolated [Ge4]4- Tetrahedral Clusters Coordinated by Li+ and Cs+ Cations or One-Dimensional [LiGe4]3- Polyanions Packed within a Matrix of Cs+ Cations?citations
  • 2017A novel high performance poly (2-methyl thioaniline) based composite electrode for supercapacitors application20citations
  • 2015A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)-epoxy interpenetrating network resin for rigid riser application25citations

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Chart of shared publication
Bobev, S.
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Freccero, R.
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Baitinger, M.
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Liang, Y.
1 / 5 shared
Jena, R. K.
2 / 4 shared
Sk, M. M.
2 / 2 shared
Chart of publication period
2024
2017
2015

Co-Authors (by relevance)

  • Bobev, S.
  • Freccero, R.
  • Baitinger, M.
  • Liang, Y.
  • Jena, R. K.
  • Sk, M. M.
OrganizationsLocationPeople

article

A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)-epoxy interpenetrating network resin for rigid riser application

  • Ghosh, K.
  • Jena, R. K.
  • Sk, M. M.
Abstract

A new class of interpenetrating network (IPN) resin system was developed by mixing tetrafunctional epoxy resin (TGDDM) with diallyl bisphenol A (DBA) modified bismaleimide (BMI) for rigid riser applications at high temperatures of more than 280 °C. The curing kinetics of the resins were assessed by differential scanning calorimetry (DSC). Epoxy resin with DBA modified BMI (BMI/DBA-epoxy IPN) showed low activation energy which is due to the autocatalytic effect of DBA modified BMI in the curing process. The thermal stability of the cured resins as evaluated using thermogravimetric analysis (TGA) showed that they were stable up to 325 °C. Dynamic mechanical analysis (DMA) showed that the BMI/DBA-epoxy IPN resin had a glass transition temperature (T<sub>g</sub>) equal to that of neat epoxy of around 280 °C. The incorporation of DBA modified BMI into the epoxy resin enhanced the mechanical properties such as tensile, flexural and impact strength by 25%, 30% and 45%, respectively compared to neat epoxy resin. Furthermore, the viscosity of the IPN was 0.3-1 Pa s which is within the filament winding range required for rigid risers. Prototype rigid risers were made using the BMI/DBA-epoxy IPN resin as matrix and carbon fiber as the reinforcement using the filament winding technique. The approach presented here represents a good approach to developing high performance high thermal stability resins for rigid risers in oil field applications. © The Royal Society of Chemistry 2015.

Topics
  • impedance spectroscopy
  • Carbon
  • glass
  • glass
  • strength
  • viscosity
  • thermogravimetry
  • glass transition temperature
  • differential scanning calorimetry
  • activation
  • resin
  • curing
  • dynamic mechanical analysis