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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Han, Anpan
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2017Influence of Ti and Cr Adhesion Layers on Ultrathin Au Filmscitations
- 2014$mathrm{(NH_{4})_{4}Sn_{2}S_{6}·3H_{2}O}$: Crystal Structure, Thermal Decomposition, and Precursor for Textured Thin Filmcitations
- 2012An ice lithography instrumentcitations
- 2011Ice lithography for nanodevicescitations
- 2011An ice lithography instrumentcitations
- 2010Ice Lithography for Nanodevicescitations
Places of action
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article
Ice Lithography for Nanodevices
Abstract
We report the successful application of a new approach, ice lithography (IL), to fabricate nanoscale devices. The entire IL process takes place inside a modified scanning electron microscope (SEM), where a vapor-deposited film of water ice serves as a resist for e-beam lithography, greatly simplifying and streamlining device fabrication. We show, that labile. nanostructures such as carbon nanotubes can be safely imaged in an SEM when coated in ice. The ice film is patterned at high e-beam intensity and serves as a mask for lift-off without the device degradation and contamination associated with e-beam imaging and polymer resist residues. We demonstrate the IL preparation of carbon nanotube field effect transistors with high-quality trans-conductance properties.