693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Martins, J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2020Novel laser-assisted glass frit encapsulation for long-lifetime perovskite solar cellscitations
- 2019Development of hermetic glass frit encapsulation for perovskite solar cellscitations
- 2017Low temperature hermetic laser-assisted glass frit encapsulation of soda lime glass substratescitations
- 2017Development of stable current collectors for large area dye-sensitized solar cellscitations
- 2014Evaluation of Bonding Performance of Amino Polymers Using ABEScitations
- 2013Dispersion of graphene nanoplatelets in poly(vinyl acetate) latex and effect on adhesive bond strengthcitations
Places of action
| Organizations | Location | People |
|---|
article
Low temperature hermetic laser-assisted glass frit encapsulation of soda lime glass substrates
Abstract
Room temperature and low temperature (120 degrees C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of < 5 x 10(-8) atm cm(3) s(-1), maintaining its leak rate even after standard climatic cycle tests. Small size devices were bonded at room temperature while larger areas were sealed at the process temperature of 120 degrees C. The sealing parameters were optimized through response surface methodology that makes the process capable for further development regardless of device size.