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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Kristensen, Peter Kjær
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Metal-organic framework-intercalated graphene oxide nanofiltration membranes for enhanced treatment of wastewater effluentscitations
- 2024Metal-organic framework-intercalated graphene oxide nanofiltration membranes for enhanced treatment of wastewater effluentscitations
- 2023Magnetron Sputter Deposition of Nanostructured AlN Thin Filmscitations
- 2022Interfacial adhesion strength of III-N heterostructurescitations
- 2018Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallizationcitations
- 2018Comparative study of Al metallization degradation in power diodes under passive and active thermal cyclingcitations
- 2018Optical characterization of SiC films grown on Si(111)
- 2018Optical characterization of SiC films grown on Si(111)
- 2018Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnectscitations
- 2016Mechanisms of metallization degradation in high power diodescitations
- 2015Effects of thermal cycling on aluminum metallization of power diodescitations
- 2015Nonfouling tunable βCD dextran polymer films for protein applicationscitations
- 2014Deposition of thin ultrafiltration membranes on commercial SiC microfiltration tubescitations
- 2013Influence of Two Compatibilizers on Clay/PP Nanocomposites Propertiescitations
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article
Effects of thermal cycling on aluminum metallization of power diodes
Abstract
Reconstruction of aluminum metallization on top of power electronic chips is a well-known wear out phenomenon under power cycling conditions. However, the origins of reconstruction are still under discussion. In the current study, a method for carrying out passive thermal cycling of power diodes in a controlled environment is developed, thus eliminating possible contribution to degradation from electric current and humidity. The focus is centered on the structural changes in the top Al metallization layer of the power diodes, correlated with the<br/>change of sheet resistance. Since the atmosphere is controlled and the device is not subjected to a current load the observed degradation of metallization and corresponding increase of resistance is purely induced by thermo-mechanical stress. A correlation between number of cycles, micro-structural evolution, and sheet resistance is found and conclusions on the dominant role of thermo-mechanical stresses are achieved. Additionally, proposals are made on how the current thermal test setup can be further developed to study the role of corrosion.