| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Martins, R. M. S.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2019New WC-Cu composites for the divertor in fusion reactorscitations
- 2017The effect of heating rate on the phase transformation of Ni/Ti multilayer thin filmscitations
- 2015Phase transformations in Ni/Ti multilayers investigated by synchrotron radiation-based x-ray diffractioncitations
- 2013Ni-Ti surface with depressed nickel concentration for biomedical applications prepared by plasma immersion ion implantation
- 2012X-ray diffraction studies during magnetron co-sputtering of Ni-Ti shape memory alloy films
- 2010Structural evolution of magnetron sputtered shape memory alloy Ni–Ti filmscitations
- 2009Texture Development and Phase Transformation Behavior of Sputtered Ni-Ti Filmscitations
- 2009Texture development and phase transformation behavior of sputtered Ni-Ti filmscitations
- 2008The interfacial diffusion zone in magnetron sputtered Ni-Ti thin films deposited on different Si substrates studied by HR-TEMcitations
- 2008Characterization of Ni-Ti (Shape memory alloy) thin film by in-situ XRD and complementary ex-situ techniques
- 2008Study of graded Ni-Ti shape memory alloy film growth on Si(100) substratecitations
- 2008Texture development in Ni-Ti thin films
- 2008Characterization of Sputtered Shape Memory Alloy Ni-Ti Films by Cross-sectional TEM and SEM
- 2007The dependence of the nanostructure of magnetron sputtered Cu–Ag alloy films on composition and temperaturecitations
- 2007In-situ study of Ni–Ti thin film growth on a TiN intermediate layer by X-ray diffractioncitations
- 2007Nucleation and growth of Ti2AlN thin films deposited by reactive magnetron sputtering onto MgO(111)citations
- 2006Structural in-situ studies of Ni-Ti thin films
- 2006Texture evolution during annealing of Ni-Ti shape memory alloy
- 2006Study of the textural evolution in Ti-rich NiTi using synchrotron radiationcitations
Places of action
| Organizations | Location | People |
|---|
article
New WC-Cu composites for the divertor in fusion reactors
Abstract
<p>The requirements for the divertor components of future fusion reactors are challenging and therefore a stimulus for the development of new materials. In this paper, WC-Cu composites are studied for use as thermal barrier between the plasma facing tungsten tiles and the copper-based heat sink of the divertor. Composite materials with 50% vol. WC were prepared by hot pressing and characterized in terms of microstructure, density, expansion coefficient, elastic modulus, Young's modulus and thermal diffusivity. The produced materials consisted of WC particles homogeneously dispersed in a Cu matrix with densifications between 88% and 98%. The sample with WC particles coated with Cu evidenced the highest densification. The thermal diffusivity was significantly lower than that of pure copper or tungsten. The sample with higher densification exhibits a low value of Young's modulus (however, it is higher compared to pure copper), and an average linear thermal expansion coefficient of 13.6 × 10<sup>−6</sup> °C<sup>-1</sup> in a temperature range between 100 °C and 550 °C. To estimate the behaviour of this composite in actual conditions, a monoblock of the divertor in extreme conditions was modelled. The results predict that while the use of WC-Cu interlayer leads to an increase of 190 °C on the temperature of the upper part of the monoblock when compared to a pure Cu interlayer, the composite will improve and reduce significantly the cold-state stress between this interlayer and the tungsten.</p>