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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Eeltink, Sebastiaan
Vrije Universiteit Brussel
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2022An ex situ and operando analysis of thiourea consumption and activity during a simulated copper electrorefining processcitations
- 2020Evaluation of particle and bed integrity of aqueous size-exclusion columns packed with sub-2 µm particles operated at high pressurecitations
- 2015Poster: A comprehensive study of the macro- and mesopores size distributions of polymer monoliths using complementary physical characterization techniques
- 2012High-pressure ion chromatography in capillary columns and microfluidic chips
- 2011High-resolution separations of protein isoforms with liquid chromatography time-of-flight mass spectrometry using polymer monolithic capillary columns
- 2011Ultra-high-resolution separations of intact proteins with LC-TOF-MS using polymer monolithic columns
Places of action
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article
An ex situ and operando analysis of thiourea consumption and activity during a simulated copper electrorefining process
Abstract
Electroreduction is an essential electrochemical technique, applied in many industries. The process can be used to produce coatings, circuit boards, to refine metals, etc. Electroreduction during plating or refining is assisted by organic or inorganic additives present in the electrolyte, with the aim to produce smooth metal deposits. A complex component of most additive mixtures in copper refining is thiourea. This work applies a coupled approach to study the time dependent characteristics of thiourea in a copper plating solution. Operando Odd Random Phase Electrochemical Impedance Spectroscopy (ORP-EIS) is used to study the electrochemical behavior of the plating solution during the process of plating while the concentration of thiourea is determined using ion chromatography. The combination of these techniques allows an in-depth study of the plating process, describing the additive behavior in the bulk electrolyte and the additive impact on the cathode plating process.