Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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977 Locations available

693.932 PEOPLE
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Amalu, Dr Emeka

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Teesside University

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (19/19 displayed)

  • 2024Mineral wastes1citations
  • 2024Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package8citations
  • 2024Critical methods of geopolymer feedstocks activation for suitable industrial applications1citations
  • 2024Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability13citations
  • 2023Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging12citations
  • 2023Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors2citations
  • 2021Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions82citations
  • 2020Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loading13citations
  • 2019Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing10citations
  • 20193D printing of intricate sand cores for complex copper castingscitations
  • 2018Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.citations
  • 2016Effects of component stand-off height on reliability of solder joints in assembled electronic componentcitations
  • 2015Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assemblycitations
  • 2015A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly134citations
  • 2012High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height15citations
  • 2012High temperature reliability of lead-free solder joints in a flip chip assembly58citations
  • 2012Thermal management materials for electronic control unit5citations
  • 2012Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations18citations
  • 2011Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser modulecitations

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Chart of shared publication
Kehinde, O.
1 / 1 shared
Hughes, David
4 / 16 shared
Depiver, Joshua A.
4 / 5 shared
Mallik, Sabuj
7 / 10 shared
Kehinde, Oluyemi
1 / 2 shared
Hughes, David J.
1 / 5 shared
Nebo, Sunday E.
1 / 1 shared
Njoku, Jude E.
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Ekere, Ndy
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Ekpu, Mathias
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Ogbodo, Eugene A.
1 / 2 shared
Depiver, Joshua Adeniyi
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Harmanto, Dani
1 / 1 shared
Sutherland, Luke
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Bhatti, Raj
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Ogunsemi, B.
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Zarmai, M. T.
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Oduoza, C. F.
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Ekere, N. N.
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Ekere, Ndy N.
2 / 3 shared
Otiaba, K. C.
1 / 1 shared
Bhatti, R. S.
1 / 1 shared
Mallik, S.
1 / 4 shared
Takyi, G.
1 / 1 shared
Chart of publication period
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Co-Authors (by relevance)

  • Kehinde, O.
  • Hughes, David
  • Depiver, Joshua A.
  • Mallik, Sabuj
  • Kehinde, Oluyemi
  • Hughes, David J.
  • Nebo, Sunday E.
  • Njoku, Jude E.
  • Ekere, Ndy
  • Ekpu, Mathias
  • Ogbodo, Eugene A.
  • Depiver, Joshua Adeniyi
  • Harmanto, Dani
  • Sutherland, Luke
  • Bhatti, Raj
  • Ogunsemi, B.
  • Zarmai, M. T.
  • Oduoza, C. F.
  • Ekere, N. N.
  • Ekere, Ndy N.
  • Otiaba, K. C.
  • Bhatti, R. S.
  • Mallik, S.
  • Takyi, G.
OrganizationsLocationPeople

article

Critical methods of geopolymer feedstocks activation for suitable industrial applications

  • Kehinde, Oluyemi
  • Amalu, Dr Emeka
  • Hughes, David
Abstract

<p>As health and safety issues emanating from human activities on terrestrial environment is becoming ever challenging, the production of Ordinary Portland Cement is identified as a key contributor. This technology threatens environmental quality by emitting significant quantity of carbon dioxide (CO<sub>2</sub>) that threatens Net Zero delivery. Consequently, the development of cement alternatives with substantial CO<sub>2</sub> reduction/sequestration during production has become imperative. Geopolymers obtained from industrial residues are poised as promising alternatives in managing environmental systems but selection of appropriate method of activation has limited their wider industrial applications. This article discusses four key activation methods and their combinations used in four main feedstocks to advise on their energy requirements, product compressive strength and environmental/industrial applications. Reviewing and characterising 302 published literatures with focus on most relevant and recent advances in the field, this review found that hybrid techniques combining mechanical activation method produces geopolymers with the highest compressive strength and thus the best method. Geopolymer made by mechano-chemical activation method of slag achieved the highest compressive strength while geopolymer produced by microwave assisted activation of clay and ultrasonic activation of fly ash cum slag are most economical in curing energy demand. Hybrid activation is the current development in the field and integration of this method with mechanical activation is poised as the future geopolymer activation technology as it demonstrates greatest efficiency potential.</p>

Topics
  • impedance spectroscopy
  • Carbon
  • strength
  • cement
  • ultrasonic
  • activation
  • curing