| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Roy, Sudipta
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Modelling the scaling-up of the nickel electroforming processcitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2019Electrodeposition of Fe-Sn from the chloride-based electrolytecitations
- 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applications
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Pt-Ni Subsurface Alloy Catalystscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gapcitations
- 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approachcitations
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2015A soluble molecular variant of the semiconducting silicondiselenidecitations
- 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acidcitations
- 2015Codeposition of Cu-Sn from ethaline deep eutectic solventcitations
- 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gapcitations
- 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DEScitations
- 2012Pulse Plating
Places of action
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article
Codeposition of Cu-Sn from ethaline deep eutectic solvent
Abstract
<p>Copper and tin have been co-deposited from choline chloride ethylene glycol based deep eutectic solvent (DES) containing CuCl2.2H2O and SnCl2.2H2O. Initially, electrolyte formulation experiments were carried out containing different amounts of copper and tin at a brass cathode in a rotating cylinder Hull cell. It was found that metallic deposits containing copper and tin could be deposited from a DES containing 0.02 M CuCl2.2H2O and 0.1 M SnCl2.2H2O. Polarization scans were carried out to determine the reduction potentials for individual metals and alloys. Anodic stripping voltammetry showed that Sn co-deposits with Cu at -0.36 V, at a lower over-potential than the tin reduction potential. Smooth and bright deposits of thicknesses up to 10 μm were obtained at a potential of -0.36 V or by using a current density of −0.87 × 10−3 A cm−2. XRD analysis showed the formation of mainly Cu3Sn and some Cu5Sn6. Our results suggest that Sn is co-discharged with Cu at potentials which is noble compared to the reduction potential of the individual metal.<br/></p>