Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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Luo, Xichun

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University of Strathclyde

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (10/10 displayed)

  • 2022Challenges and issues in continuum modelling of tribology, wear, cutting and other processes involving high-strain rate plastic deformation of metals16citations
  • 2022Challenges and issues in continuum modelling of tribology, wear, cutting and other processes involving high-strain rate plastic deformation of metals16citations
  • 2017A full factorial numerical investigation and validation of precision end milling process for hardened tool steelcitations
  • 2014A theoretical assessment of surface defect machining and hot machining of nanocrystalline silicon carbide49citations
  • 2014Enabling ultra high precision on hard steels using surface defect machiningcitations
  • 2012Replacing diamond cutting tools with CBN for efficient nanometric cutting of silicon38citations
  • 2012Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide129citations
  • 2012Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide129citations
  • 2011Atomistic aspects of ductile responses of cubic silicon carbide during nanometric cuttingcitations
  • 2011Atomistic aspects of ductile responses of cubic silicon carbide during nanometric cutting76citations

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Roy, Anish
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Goel, Saurav
8 / 50 shared
Llavori, Iñigo
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Joshi, Srikrishna N.
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Mir, Amir Sarwar
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Zlatanovic, Danka Labus
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Joshi, Shrikrishna N.
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Mir, Amir
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Labus Zlatanovic, Danka
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Fitzpatrick, Stephen
1 / 14 shared
Reimer, Andreas
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Agrawal, Anupam
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Rashid, Waleed Bin
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Jain, V. K.
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Reuben, Bob
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Rashid, Walleed Bin
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Reuben, Robert L.
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Rashid, Waleed
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Co-Authors (by relevance)

  • Roy, Anish
  • Goel, Saurav
  • Llavori, Iñigo
  • Joshi, Srikrishna N.
  • Mir, Amir Sarwar
  • Zlatanovic, Danka Labus
  • Joshi, Shrikrishna N.
  • Mir, Amir
  • Labus Zlatanovic, Danka
  • Fitzpatrick, Stephen
  • Reimer, Andreas
  • Agrawal, Anupam
  • Rashid, Waleed Bin
  • Jain, V. K.
  • Reuben, Bob
  • Rashid, Walleed Bin
  • Reuben, Robert L.
  • Rashid, Waleed
OrganizationsLocationPeople

article

Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide

  • Reuben, Bob
  • Goel, Saurav
  • Luo, Xichun
Abstract

<p>Silicon carbide (SiC) is a material of great technological interest for engineering applications concerning hostile environments where silicon-based components cannot work (beyond 623 K). Single point diamond turning (SPDT) has remained a superior and viable method to harness process efficiency and freeform shapes on this harder material. However, it is extremely difficult to machine this ceramic consistently in the ductile regime due to sudden and rapid tool wear. It thus becomes non trivial to develop an accurate understanding of tool wear mechanism during SPDT of SiC in order to identify measures to suppress wear to minimize operational cost.</p><p>In this paper, molecular dynamics (MD) simulation has been deployed with a realistic analytical bond order potential (ABOP) formalism based potential energy function to understand tool wear mechanism during single point diamond turning of SiC. The most significant result was obtained using the radial distribution function which suggests graphitization of diamond tool during the machining process. This phenomenon occurs due to the abrasive processes between these two ultra hard materials. The abrasive action results in locally high temperature which compounds with the massive cutting forces leading to sp(3)-sp(2) order-disorder transition of diamond tool. This represents the root cause of tool wear during SPDT operation of cubic SiC. Further testing led to the development of a novel method for quantitative assessment of the progression of diamond tool wear from MD simulations. Crown Copyright (C) 2011 Published by Elsevier B.V. All rights reserved.</p>

Topics
  • impedance spectroscopy
  • compound
  • simulation
  • molecular dynamics
  • carbide
  • Silicon